There is a strong drive in the scientific community to control matter on the nanometer length scale that is at the level of atoms, molecules, and supramolecular structures to create useful materials, devices and systems for application in nanotechnology. Chemists have contributed greatly to this area by proposing new ways to assemble, pattern and incorporate molecules and materials that can have potential impact on the cost, speed and quality of the next generation of electronic devices such as chips, hard drive memory and energy efficient monitors. There is also a constant motivation to reduce the cost of semiconductor processing by developing novel and cheaper fabrication methods and design strategies in order to extend the life span and to address the limitations of complementary metal-oxide semiconductor (CMOS) technology. Addressing part of this problem, electrochemical processes have entered the chip manufacturing sector. Prime examples include IBM’s electrodeposited Cu interconnects on computer chips (Damascene process) and read/write heads for computer hard drives fabricated by electrodeposition of alternating magnetic and non-magnetic layers. These two innovative applications of electrochemistry are showing tremendous economical and technological impacts.

 

                                                                                                                                                                                 Our research aims at creating new thin films and nanostructured materials that possess interesting properties that can be used as sensors, light emitting devices and electronic components. Ultimately our research goals are to understand formation of these materials and to relate their structures and morphology to their electrochemical/electronic, catalytic or/and magnetic properties. These studies are critical for implementing thin film and nanostructure technologies because the surface and interface effects often dominate and alter significantly familiar bulk properties in these low dimensionality systems. In search of the next generation of thin film materials, our earlier work focussed mainly on the exploration of novel electrodeposited thin films and nanostructures. More recently we have also used hydrosilylation reaction to incorporate relevant functionalities at hydrogen-terminated silicon surfaces. The development of surface sensitive techniques outside the vacuum such as surface X-ray scattering, scanning tunnelling microscopy (STM) or atomic force microscopy (AFM) provides new ways to probe the structure and morphology of these low dimensionality materials. Up until now our main research strategy employed STM and AFM coupled with electrochemical techniques to pursue both fundamental and applied research projects. During the few years, we have also used other surface sensitive methods such as Attenuated Total Reflectance FTIR (ATR FTIR), x-ray photoelectron spectroscopy (XPS) and Matrix Assisted Laser Desorption and Ionization Mass Spectrometry (MALDI MS) in the characterization of adsorbed proteins on organic layers, organic films and polymers anchored to surfaces of conductors and semiconductors.

 

                                                                                                                                                                                 All of our research projects deal in one way or another with low dimensionality systems and the importance of changes in material properties due to the creation or presence of interfaces. We are currently engaged in several projects that involve electrodeposition of metal thin films and nanostructures: (a) the investigation of the electrodeposited multilayers with spin valve structures; (b) the study of metal electrodeposition at industrially relevant substrates; and (c) the study of the formation of epitaxial bismuth on conductors and semiconductors. Although, metal deposition is an important part of our research, we are also very interested in the formation and characterization of molecular films at silicon surfaces including the study of protein interactions with such surfaces and we are preparing novel molecules that will be used to study their covalent attachment to hydrogen-terminated silicon surfaces including the modification of silicon surfaces using metal complexes and ligands that contain an alkene moiety at one terminus (site of hydrosilylation) and a coordinating agent or metal complex (site of coordination) at the other. Another interesting way to produce sturdy films is through self-assembly of metal complexes at the surface of electrodes. Both approaches will be used in this research. This work is also relevant to the area of thin film electronic materials, molecular electronics and sensors.


 

We use a variety of equipment and techniques for our research, including: 

 

Scanning Tunneling Microscope


Atomic Force Microscope


Magneto-Optical Kerr Effect (MOKE) apparatus


Classical electroanalytical methods, including

      cyclic voltammetry and potential-step experiments


Electrochemical Impedance Spectroscopy (EIS)

 

FTIR for thin film and supported molecular layers


Single crystal preparation and characterization facility

STM tip etching and coating set-ups


 

 

Atomic Force Microscopy

 

Additionally, our research benefits from local, national, and international collaborations.
 
 

For more details


Interested in joining our group?

Read the job openings page to see what kinds of research positions are currently available.


Some of our favorite journals:

Surface Science    Journal of the American Chemical Society   Langmuir   Applied Surface Science    Electrochimica Acta    Journal of Electroanalytical Chemistry   Chemical Communications   


This page is a work in progress, maintained by the Morin group webmaster. Last updated on December 5, 2006.